This bonding selftest used to cause a kernel oops on aarch64
and should be architectures agnostic.
Signed-off-by: Jonathan Toppins <jtoppins@redhat.com>
Acked-by: Jay Vosburgh <jay.vosburgh@canonical.com>
Signed-off-by: Jakub Kicinski <kuba@kernel.org>
Test that the bonding and team drivers clean up an underlying device's
address lists (dev->uc, dev->mc) when the aggregated device is deleted.
Test addition and removal of the LACPDU multicast address on underlying
devices by the bonding driver.
v2:
* add lag_lib.sh to TEST_FILES
v3:
* extend bond_listen_lacpdu_multicast test to init_state up and down cases
* remove some superfluous shell syntax and 'set dev ... up' commands
Signed-off-by: Benjamin Poirier <bpoirier@nvidia.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
This creates a test collection in drivers/net/bonding for bonding
specific kernel selftests.
The first test is a reproducer that provisions a bond and given the
specific order in how the ip-link(8) commands are issued the bond never
transmits an LACPDU frame on any of its slaves.
Signed-off-by: Jonathan Toppins <jtoppins@redhat.com>
Acked-by: Jay Vosburgh <jay.vosburgh@canonical.com>
Signed-off-by: Jakub Kicinski <kuba@kernel.org>
