d069ed6b75
Add new helper functions, thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for binding a cooling device to a trip point and unbinding it, respectively, and redefine the existing helpers, thermal_zone_bind_cooling_device() and thermal_zone_unbind_cooling_device(), as wrappers around the new ones, respectively. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>